Media and Outreach


Media and Outreach

Three-dimensional characterization developed by a Technion researcher and her colleagues in Illinois will promote miniaturization in semiconductor manufacturing, Little-Big Challenge, 2017

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3D Imaging Helps Improve Block Copolymer Templates, report, 2017

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3D Characterization of Block Copolymer films with TEM tomography, SPIE news report, 2016

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